Package Architect – Advanced Packaging & System Exploration.Responsibilities Define and explore advanced package architectures for future memory systemsPerform package‑level trade‑off studies across SI, PI, thermals, cost, and scalabilityCreate hands‑on package designs and models for early feasibility analysisRun SI/PI and thermal simulations and translate results into architecture guidanceDefine package requirements and act as extension architecture and engineeringMinimum Qualifications Bachelor's degree or equivalent practical experience in EE, ME, Materials, or related field10+ years of hands‑on experience in package design or package‑level simulationStrong experience with package SI modeling and analysisAbility to independently build models and drive conclusionsPreferred Qualifications Master's degree in a related technical fieldExperience supporting architecture or pre‑silicon exploration teamsFamiliarity with system‑level co‑design across silicon, package, and boardExperience with multi‑die or heterogeneous integrationJob Profile(s) Systems Design Engineering SMTS – Systems Design Engineering SMTSCompensation US base salary range: $177,000.00 – $387,000.00 a year. Additional compensation may include benefits, bonuses, and equity.Equal Opportunity Employer Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.#J-18808-Ljbffr