Job Description Hiring a talent in advanced packaging design with intensive hands‑on experience in GDSII‑based physical layout and in-depth knowledge of advanced 2.5D/3D packaging architecture and technology. Skills in .mcm‑based layout are a plus.Job Scope Architect advanced packaging solutions to meet future product requirementsDefine design rules for the new technologyDesign (with physical layout) test vehicles to support technology developmentGenerate design collaterals for new technology introductionDrive design‑for‑yield and design‑for‑cost activities after a new technology is in productionQualifications Education and experience:• Bachelor's degree in Engineering and 5+ years of related experience• Master's degree in Engineering and 3+ years of related experienceCompensation and Benefits Annual base salary range: $91,000 – $146,000.Eligible for a discretionary annual bonus in accordance with relevant plan documents and equity in accordance with equity plan documents and award agreements. Broadcom offers a comprehensive benefits package including medical, dental, and vision plans, 401(K) participation with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company‑paid holidays, paid sick leave, vacation time, and compliance with applicable paid family leave and other leave policies.Equal Employment Opportunity Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status, or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.#J-18808-Ljbffr