Packaging Engineer

We are seeking a Packaging Engineer to lead end-to-end packaging development for advanced microelectronic and RF communication products. This role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules.

You will own the full packaging lifecycle—from concept and definition through design, modeling, testing, and production release—while partnering closely with cross-functional engineering teams and external vendors. This position requires deep technical expertise in semiconductor packaging, strong problem-solving skills, and the ability to drive development in a fast-paced, high-reliability environment.

Responsibilities

• Collaborate with product development teams (RFIC, MMIC, and module engineering) to design and deliver next-generation packaging solutions for RF communication systems
• Define package architectures, materials, and processes that meet performance, reliability, manufacturability, and cost requirements
• Lead packaging efforts for new product introductions (NPI) and new technology development
• Develop and manage packaging documentation, including statements of work (SOWs), drawings, and process flows
• Design and layout semiconductor packages such as QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP, and interposers
• Utilize modeling and simulation (thermal, mechanical, electrical) to ensure early-stage design success
• Provide technical oversight to external vendors and manufacturing partners throughout package fabrication
• Apply expertise in assembly processes (die attach, wirebond, bumping, overmolding) to guide design decisions and troubleshoot issues
• Evaluate and recommend packaging solutions through feasibility studies for new products
• Partner with engineering teams to optimize packaging for cost and performance
• Define and oversee reliability testing to ensure product robustness and compliance
• Coordinate cross-functional efforts across design, test, quality, manufacturing, and supply chain teams
• Identify and resolve material and process challenges during development
• Manage packaging projects using industry-standard tools and methodologies
• Contribute to long-term packaging technology roadmaps and support proposal efforts

Qualifications

• 10+ years of experience in semiconductor packaging, including package engineering, assembly processes, and reliability
• Bachelor’s degree in Electrical, Mechanical, Materials Engineering, or a related technical field
• Strong understanding of microelectronic packaging, including mechanical, electrical, and thermal performance considerations
• Solid foundation in heat transfer and material properties
• Experience supporting RFIC, millimeter wave, SiP, or module-based products
• Hands-on experience with package design technologies such as QFN, SiP, BGA, WL-CSP, Flip Chip, bumping, or FO-WLP
• Knowledge of semiconductor assembly processes, including die prep, die attach, wirebonding, flip chip, and SMT
• Familiarity with interconnect reliability testing (e.g., daisy chain, CPI, BLR)
• Understanding of metallization schemes for laminates, interposers, and SMT
• Experience with statistical analysis and design of experiments (DOE)
• Ability to operate independently and drive technical decisions in ambiguous environments
• Strong communication and collaboration skills across cross-functional teams
• Experience translating system or IC requirements into packaging solutions

Additional Requirements

• U.S. Citizenship required
• Ability to travel up to 10%