Cspeed IO is a stealth start up backed by Sutter Hills Ventures and Atreides Capital - headquartered in Palo Alto, CA. Our executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware.
Cspeed IO is developing next-generation optical semiconductor solutions for the AI infrastructure market, focused on enabling true “scale-up” architectures. Our mission is to replace traditional copper interconnects with advanced fiber-optic technologies that overcome the limitations of existing optics solutions and architectures.
Duties, Deliverables, and Responsibilities
Drive Cspeed’s package from initial concept to production
Help establish photonic and electronic co-design process flow
Work with OSAT’s to define integration packaging design rules, process flow, and materials
Lead optical package development to establish package manufacturability and reliability.
Collaborate with cross-functional teams including of silicon photonics, IC design, layout, test and reliability to drive the package/integration forward
Work with external foundries and OSAT’s on process integration and packaging for interposer
Expertise, Knowledge, and Skills
Understanding of 2.5D and 3D packaging technologies, i.e. interposers, heterogeneous integration, high-density interconnects
Ability to select and manage external foundries/OSATs for interposer-based packaging (must understand material selection, state of the art techniques, and advanced process flows required for advanced packaging)
Must have strong program/project management skills (i.e. set schedule, maintain it, ensure parts arrive on time in the right place, etc.)
Clear communication, ability to work cross-functionally and interface with design, SI/PI, testing, vendors, OSATs, etc
Bonus: Familiarity with layout design for high-speed applications, simulation, mechanical and thermal analysis
Experience, Background, and Accomplishments
Driven multiple 2.5/3D high-speed packages end to end, working with all roles on the packaging team (design, layout, SI/PI, test and reliability, etc.)
Experience driving packages with unconventional needs / uncommon processes
Experience working with large, established OSAT’s and foundries on custom processes and flows
B.Sc.+ in EE or Materials or optics
Bonus: experience with CPO packaging, integrated PIC + EIC package