Onsemi is hiring a Semiconductor Packaging Modeling and Simulation Engineer in Scottsdale, AZ. This role involves conducting thermal-mechanical simulations for microelectronic packaging and improving modeling methodologies. Candidates should have a Master's or PhD in relevant fields and experience with thermal and mechanical modeling. A competitive salary ranging from $146,970 to $249,780 is offered along with a comprehensive benefits package.#J-18808-Ljbffr