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Packaging Module Development Engineer

INTEL

Phoenix, AZ

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JOB DETAILS
SALARY
$127,400–$179,900 Per Year
SKILLS
Analysis Skills, Assemblers Technology, Automation, Chemical Engineering, Chemistry, Cloud Computing, Continuous Improvement, Cross-Functional, Data Analysis, Develop Methodologies, Diversity, Equipment Maintenance/Repair, Equipment Specification, Experiment Design, Fourier-Transform Infrared Spectroscopy (FTIR), Identify Issues, Integrated Circuit Packaging, Intel Product Family, Internet of Things, Leadership, Manufacturing, Manufacturing Process Engineering, Manufacturing/Industrial Processes, Material Science, Materials Testing, Mechanical Engineering, Memory Hardware, Microsoft Office, Physics, Process Capability, Process Control Engineering, Process Development, Process Improvement, Quality Assurance Methodology, Quality Metrics, Risk Analysis, Search Engine Marketing (SEM), Semiconductor Manufacturing, Semiconductors, Statistical Process Control, Statistics, Sustainability, Team Player, Technology White Papers, Test Equipment, Ubiquity, United States Department of Energy (DOE), Vendor/Supplier Evaluation, Vendor/Supplier Selection
LOCATION
Phoenix, AZ
POSTED
Today

Job Description


Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving process and equipment innovations critical to Intel's roadmap for assembly packaging platform technologies. Your contributions will empower the manufacturability of next-generation products, ensuring they meet stringent quality, reliability, cost, yield, and productivity requirements. As part of a collaborative and forward-thinking team, you'll tackle complex challenges, develop cutting-edge methods, and push the boundaries of what's possible in packaging technology. Be part of a dynamic environment where your expertise and creativity will make a meaningful impact on Intel's success and leadership in the semiconductor industry.

Key Responsibilities

  • Develop and optimize advanced packaging processes and equipment to support Intel's Glass Core and CPO roadmap.
  • Define and implement process specifications, equipment configurations, and workflows for new technologies, ensuring seamless integration into manufacturing.
  • Apply design of experiments (DOE) principles to characterize process windows and understand the interactions between equipment, materials, and processes.
  • Drive continuous improvements in process capability, quality, reliability, cost, yield, automation, and productivity.
  • Develop and maintain equipment for testing silicon and package technologies under simulated field conditions, including thermal, humidity, and mechanical stress environments.
  • Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet strict quality standards.
  • Lead efforts to develop innovative techniques, tools, and methods to accelerate technology readiness and identify risks early in the development cycle.
  • Document advancements through white papers, technical reports, and data analysis.
  • Partner with cross-functional engineering teams and external stakeholders to address packaging challenges and align solutions with Intel's strategic goals.

Qualifications


Minimum qualifications are required to be initially considered for this position.  Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. 

Minimum Qualifications:

  • Bachelor's or MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a related technical field.
  • +4 years of experience in:
    • Process development, equipment adjustment, and manufacturing process control.
    • Design of experiments (DOE) principles and statistical data analysis.
    • Process characterization and statistical process control methodologies.
    • Material testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.

Preferred Qualifications

  • Master's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field.
  • Analytical skills and experience troubleshooting integrated technology challenges.
  • Advanced statistical tools, process control frameworks, and Microsoft Office software suite applications.
  • Experience working with both organic and inorganic materials in packaging processes.
  • 1 year of Photolithography experience.

Join Intel's mission to innovate and lead in the field of advanced packaging technologies. Apply now to become part of the team shaping the future of semiconductor manufacturing.


Inside this Business Group


Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.



Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience


Working Model


This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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