Advanced training in electronics with a minimum of 5 years' experience in an electronic design office.
Strong expertise in electronic CAD tools and PCB layout, with proficiency in CADENCE/Allegro.
In-depth knowledge of materials, technologies, and industrial processes used in PCB manufacturing and component packaging.
Proven experience with high-speed interfaces including Ethernet (2.5G/5G/10G), PCIe, DDR, and other high-speed memory interfaces.
Good understanding of DFM (Design for Manufacturing) and DFT (Design for Testability) principles in PCB design.
Experience working in airborne environments, considering thermal, shock, EMI, and EMC constraints.
Expertise in PCB design for low-pitch, high-density BGAs and SMD/BGA connectors.
Strong knowledge of high-speed signal and power supply design considerations such as impedance control, length matching, and shielding.
Familiarity with Product Data Package (PDP) contents, including data files, Bill of Materials (BOM), item lists, documentation, COTS, material and process items, and related components.
Experience with stack-up design and constraint management tools.
Awareness of thermal, mechanical, and EMC constraints in PCB and PCBA design.
Experience collaborating with multidisciplinary teams, including electronics, mechanical, and system engineering groups.
Experience in Signal Integrity (SI) and Power Integrity (PI) simulation is an added advantage.
Good to have:
Individual contributor capable of owning and executing allocated responsibilities with minimal support.
Working experience in Defense/Avionics/Aerospace systems design is desirable.