PCB & Substrate Layout Engineer (On-Site Preferred)

Principal PCB & Substrate Layout Engineer

Position Overview

We are seeking an experienced Principal PCB & Substrate Layout Engineer to provide technical leadership and hands-on expertise in the design and development of advanced printed circuit boards, high-density substrates, and microelectronic packaging solutions. This role will support complex electronic systems requiring high-speed interfaces, high-density interconnect technologies, and advanced packaging architectures.

The successful candidate will serve as a technical leader, driving layout excellence, supporting multidisciplinary engineering teams, and ensuring designs are optimized for performance, manufacturability, reliability, and quality.

Key Responsibilities

Technical Leadership

• Provide technical leadership for PCB and substrate layout activities focused on high-speed interfaces and high-density packaging technologies.
• Drive continuous improvement of layout methodologies, design processes, and best practices.
• Mentor engineers and layout designers while supporting complex development programs.

PCB & Substrate Design

• Lead the design, layout, and analysis of complex electrical and mechanical systems, including:
• High-density interposers
• Advanced substrates
• Multi-layer PCBs
• Flip-chip architectures
• Digital, analog, power, and RF signal routing
• Develop designs utilizing:
• High-Density Interconnect (HDI) technologies
• Blind and buried vias
• Ball Grid Arrays (BGAs)
• Differential pair routing
• Controlled impedance structures
• Design for Test (DFT)
• Electromagnetic Compatibility (EMC) principles
• Perform stack-up development, impedance calculations, crosstalk analysis, and material selection studies.
• Support package material characterization and modeling, including:
• Skin effect analysis
• Surface roughness considerations
• Dielectric constant and loss evaluation
• Frequency-dependent material modeling

Manufacturing & Supplier Support

• Apply Design for Manufacturing (DFM) principles and ensure layouts align with supplier capabilities.
• Develop fabrication documentation and drawings that accurately communicate design intent.
• Support fabrication and assembly suppliers throughout the manufacturing process.
• Validate manufacturing deliverables using CAM tools and industry best practices.
• Review artwork and manufacturing documentation throughout the design lifecycle.

Cross-Functional Collaboration

• Participate in design reviews, manufacturing readiness reviews, and technical evaluations.
• Support multidisciplinary investigations, feasibility studies, and technology development efforts.
• Collaborate with:
• Electrical Engineering
• Mechanical Engineering
• Manufacturing Operations
• Quality
• Supply Chain
• Customers
• Suppliers and fabrication partners
• Provide technical guidance to internal and external stakeholders throughout product development.

CAD & Documentation Responsibilities

• Create and maintain assembly drawings using AutoCAD.
• Develop, manage, and maintain DX Designer/CAE component libraries.
• Coordinate CAD data and design packages with external PCB layout vendors.
• Define and implement CAD methodologies, software applications, and design standards.
• Develop automation scripts and utilities to improve engineering tool efficiency.
• Ensure fabrication drawings accurately reflect engineering requirements and specifications.
• Support footprint development and component library management for PCB design.
• Provide schematic support to the Electrical Engineering organization.
• Evaluate supplier capabilities and support material, equipment, and service selections.

Required Qualifications

• Bachelor's degree in Engineering or equivalent combination of education and experience.
• Minimum 10 years of experience in PCB and/or high-density package layout design.
• Expert-level experience with Cadence APD+ (Allegro) and associated layout tools.
• Experience with APD+ Physical and Electrical Constraint Editor.
• Extensive experience designing:
• High-Density Interconnect (HDI) structures
• Blind and buried micro-vias
• Specialty RF dielectric materials
• Fine-line routing technologies down to 2m/2m geometries
• Experience with advanced packaging technologies including:
• 2.5D devices
• Interposer design
• Substrate design
• Flip-chip packaging
• Die stacking
• Package stacking
• Substrate stacking
• Experience with schematic and netlist-driven layout processes.
• Strong understanding of digital, analog, and RF layout methodologies.
• Knowledge of electronic packaging technologies and advanced semiconductor packaging concepts.
• Experience collaborating with Mechanical Engineering teams on 3D modeling, fit checks, and thermal integration.
• Experience using CAM tools for manufacturing validation.
• Working knowledge of JEDEC and IPC standards for design, fabrication, and assembly.
• Experience creating fabrication packages and assembly documentation.

Preferred Qualifications

• Experience with CAM350, Blueprint, or similar manufacturing validation tools.
• High-end FPGA package or board design experience.
• Experience supporting aerospace, defense, space, telecommunications, semiconductor, or other highly regulated industries.
• Familiarity with advanced microelectronics manufacturing processes.
• Experience supporting highly reliable or mission-critical electronic systems.

Desired Skills

• Strong technical leadership and mentoring capabilities.
• Excellent analytical and problem-solving skills.
• Ability to evaluate complex technical issues and develop practical solutions.
• Strong communication and collaboration skills.
• Commitment to quality, execution, and continuous improvement.
• Ability to thrive in a fast-paced, multidisciplinary engineering environment.
• Systems-thinking mindset with the ability to understand impacts across the full product lifecycle.
• Willingness to support team objectives beyond individual areas of expertise.

Additional Requirements

• Must be eligible to work in the United States.
• Ability to work effectively both independently and within cross-functional teams.

EOE (including Disability/Veterans)

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