We are searching for a Power Discrete New Product Engineering Technical Leader (MTS) to drive all product-level engineering activities for Si, SiC discrete devices in automotive and industrial applications at onsemi. This is a high-priority business growth area for the division, and we invite you to join us in this exciting career opportunity.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
- Master's degree in Electrical/Electronics or Materials Science.
- 10+ years of semiconductor discrete power device development (Si, SiC).
- Strong knowledge of device physics, packaging, and reliability for discrete products.
- Leadership capability to influence and lead teams across functional organizations.
- Excellent communication skills to represent engineering activities to executive leadership.
The successful candidate will combine strong technical expertise with leadership and communication skills to act as the engineering owner for discrete products, ensuring alignment between technical execution and business objectives. This individual will collaborate with global new product development teams and cross-functional organizations to define, prioritize, and drive product-level engineering activities, making decisions that achieve performance, reliability, cost, and schedule targets.
Own Product-Level Engineering Decisions
- Define and maintain the Product Technical Requirements Document (PTRD/PTS) for Si/SiC/GaN discrete devices.
- Identify and evaluate candidate process technologies for feasibility and risk.
- Develop system-level models to validate product architecture and performance.
- Estimate die size, CLC, and total manufacturing cost for business case alignment.
- Create and maintain a preliminary risk register with mitigation strategies.
Lead Cross-Functional Design Execution
- Drive creation of Functional Interface Tool (FIT) for new die.
- Oversee package electrical and mechanical modeling for discrete packages.
- Validate product-level performance through 3D modeling and simulation.
- Coordinate design FMEA and implement Best Known Methods (BKMs).
- Facilitate product design reviews and acceptance gates.
- Develop and approve product design validation plans.
- Ensure achievement of process and product design freeze milestones.
- Provide design rules and resolve technical issues for product qualification and release.
- Define target yields and associated risk factors.
Drive Engineering Execution and Decision-Making
- Chair weekly project team meetings for problem solving, prioritizing issues and making timely decisions.
- Act as the single point of accountability for engineering deliverables and present to stakeholder review.
Ensure Smooth Handoff to Manufacturing
- Support transition from development to high-volume manufacturing post product release.
- Validate readiness of processes, documentation, and quality standards.
The successful candidate will combine strong technical expertise with leadership and communication skills to act as the engineering owner for discrete products, ensuring alignment between technical execution and business objectives. This individual will collaborate with global new product development teams and cross-functional organizations to define, prioritize, and drive product-level engineering activities, making decisions that achieve performance, reliability, cost, and schedule targets.
Own Product-Level Engineering Decisions
- Define and maintain the Product Technical Requirements Document (PTRD/PTS) for Si/SiC/GaN discrete devices.
- Identify and evaluate candidate process technologies for feasibility and risk.
- Develop system-level models to validate product architecture and performance.
- Estimate die size, CLC, and total manufacturing cost for business case alignment.
- Create and maintain a preliminary risk register with mitigation strategies.
Lead Cross-Functional Design Execution
- Drive creation of Functional Interface Tool (FIT) for new die.
- Oversee package electrical and mechanical modeling for discrete packages.
- Validate product-level performance through 3D modeling and simulation.
- Coordinate design FMEA and implement Best Known Methods (BKMs).
- Facilitate product design reviews and acceptance gates.
- Develop and approve product design validation plans.
- Ensure achievement of process and product design freeze milestones.
- Provide design rules and resolve technical issues for product qualification and release.
- Define target yields and associated risk factors.
Drive Engineering Execution and Decision-Making
- Chair weekly project team meetings for problem solving, prioritizing issues and making timely decisions.
- Act as the single point of accountability for engineering deliverables and present to stakeholder review.
Ensure Smooth Handoff to Manufacturing
- Support transition from development to high-volume manufacturing post product release.
- Validate readiness of processes, documentation, and quality standards.