Micron Technology seeks a Principal Engineer in Boise to drive innovation in advanced packaging technology. You will influence strategic decisions and shape technology roadmaps while collaborating with partners. The ideal candidate has 5+ years in semiconductor packaging, a relevant degree, and deep knowledge of integration strategies. Benefits include choice of medical plans, paid leave, and a robust paid time-off program. Join a team united by a commitment to innovation and excellence.#J-18808-Ljbffr