Principal Field Process Engineer

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Principal Field Process Engineer (Hillsboro, OR)

The Principal Field Process Engineer (FPE) is a senior individual contributor within ASM’s Key Account organization (Global Sales & Services) and serves as the technical authority and escalation owner for customer‑facing process applications. This role operates with high autonomy, leading complex new product introductions (NPI), on‑site process development, and HVM transfers, while acting as the primary technical interface between ASM Business Units and customer process teams.

What you'll be working on

• Own technical delivery and escalation for NPI of advanced deposition processes and hardware (thermal ALD, plasma ALD, Area Selective Deposition).
• Lead complex troubleshooting, root cause analysis, and cross‑functional resolution with customers, Business Units, and field teams.
• Drive on‑site process and hardware development, including DOE‑based experiments and continuous improvement initiatives.
• Identify and advance new ASM technology and film opportunities aligned to customer roadmaps.
• Lead process transfer to HVM fabs and develop/transfer Best Known Methods (BKMs) to service and manufacturing teams.
• Capture and feedback technical learnings to influence future ASM hardware, process, and qualification packages.

What we are looking for

• M.S. or PhD in Chemistry, Chemical Engineering, Materials Science, Physics, or related field.
• 7–10 years of experience in thin‑film deposition (ALD).
• Strong expertise in semiconductor device integration, vacuum systems, film metrology, and structured problem solving.
• Proven ability to independently design experiments, manage escalations, and influence without authority.
• Excellent technical communication skills and strong IP awareness.
• Flexibility to travel and support extended hours during qualifications or escalations.

What sets you apart

• Hands‑on experience with ASM ALD, PEALD, PECVD, Epitaxy, or Vertical Furnace LPCVD equipment.
• Demonstrated success optimizing deposition processes in development 
• Experience leading customer-facing technical discussions or escalations.
• Experience coordinating cross-functional action plans during escalations.