A technology startup in San Jose is seeking an experienced IC Package Mechanical FEA Engineer to develop high-performance packaging solutions for advanced ASICs. The ideal candidate will possess a Bachelor's in Mechanical Engineering or related field and have extensive experience with FEA tools and advanced packaging technologies. Responsibilities include performing simulations, collaborating with various teams, and supporting technology road-mapping. This role offers a unique opportunity to impact the future of AI-focused technologies.#J-18808-Ljbffr