$190,000–$250,000 Per Year
Analysis Software, Artificial Intelligence (AI), Broadband, Diagnostics Solutions/Software, Digital Signal Processing (DSP), Electrical Engineering, Electricity, Energy Efficiency, Establish Priorities, Manufacturing, Material Science, Memory Hardware, Optical Engineering, Optical Ethernet, Optical Transceivers, PCI Express (PCI-E), Physics, Product Development, Product Packaging, Product Planning, Product Support, Product/Service Launch, Supply Chain, Support Documentation, System Architecture, Vendor/Supplier Relations, Willing to Travel
About the role
Participate in the characterization and development of packaging materials and processes tailored for high-speed optical communication. This role is part of Credo's optical communications team and focuses on enabling manufacturable, reliable, and scalable packaging solutions for next-generation optical devices.
Base salary range is $190,000 to $250,000 a year. The base salary offer will depend on factors such as education, experience, training, skills, qualifications, and location. This position is also eligible for a discretionary bonus, equity and a full range of medical and other benefits.
Why Credo
- Purpose: We invest in what matters. From meaningful-future shaping projects to competitive compensation, we empower you to grow your career while making a lasting impact.
- People: Connection starts within. We collaborate, celebrate wins, and create an environment where everyone can do their best work.
- Possibilities: Our belief shapes what's next. Our technology powers the most reliable and energy-efficient connections around the world - and our team powers new products and markets that come next.
Responsibilities
- Collaborate with system architects to design and verify packaging technics and materials that meet product specifications.
- Collaborate with Credo technical team on process/material experimental comparison and make prioritized recommendations.
- Collaborate with Credo NPI to verify manufacturability and reliability through experimentation at selected Credo manufacturing partners.
- Contribute to development of core packaging technologies that can be fully verified and documented in support of Credo product roadmap products.
- Educate Credo engineers on novel materials and processes used on optical devices and share key supplier relationships.
Qualifications
Basic Qualifications
- Relevant experience developing optical device packaging techniques and materials.
- Relevant experience releasing to high volume manufacturing novel optical device materials and processes.
- Flexibility with travel to support global supply chain.
Preferred Qualifications
- MS/PhD in Electrical Engineering, Material Science, Physics or similar field.
- Experience bringing photodiodes into high volume commercial applications.
- Experience in 6-sigma, DFX or similar approaches to product development.
About Credo
Credo's mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect products deliver industry-leading power and performance at up to 1.6T to meet the ever-expanding data infrastructure demands of AI.
Our product portfolio includes ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers, OmniConnect memory solutions, and a suite of retimers and DSPs for optical and copper Ethernet and PCIe, all leveraging the PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world.
Credo is committed to creating an inclusive environment for all employees and welcome applicants from diverse backgrounds without regard to race, color, religion, gender, sex, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis. If you have a disability or special need that requires accommodation to navigate our website or complete the application process, email people@credosemi.com.
Apply Now