$200,000–$280,000 Per Year
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Principal Packaging Engineer - California, United States - 188863 - Koch
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Principal Packaging Engineer
Location(s)
Fremont, California
Company
Molex
Career Field
Engineering
Job Number
188863
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Molex is a global leader in the optical industry, renowned for delivering high-performance, field-proven wavelength management solutions. Our expertise spans components, modules, and integrated line-cards, with a strong focus on innovation, miniaturization, and manufacturing automation. Our advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing.
The Laser Packaging Principal Engineer will own the technical leadership for advanced optoelectronic packages (e.g., CPO, ELSFP). This role is responsible for component design and selection, performance optimization, and long-term reliability assurance of laser diodes and components embedded within advanced optoelectronic packages. The position requires close collaboration with R&D and product design teams, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.
What You Will Do
- Provide technical leadership and creativity to design novel III-V laser diode packaging technologies to support Datacenter growth
- Design packages that includes components (e.g., TEC, housing, lid, getter, fiber lens or discrete lenses, gratings)
- Develop processes that includes submicron alignment (x, y, z, f), solder attach of components (e.g., laser diode, ceramic mounts, TEC, etc.) and hermetic lid sealing
- Partner with product and operation teams to ensure designs are compatible with manufacturable, high-yield assembly flows
- Support sub-component supplier selection and evaluation, including technology maturity assessments for robust supply chain
- Support supplier improvement through audits, quality improvement plans, and risk-mitigation initiatives
- Define and oversee component pre-qualification and qualification strategies, including GR-468 Telcordia compliance
- Support failure analysis investigations and corrective actions for product related failures and manufacturing issues, working with internal teams, suppliers, and customers
- Work intimately with laser diode experts to create optimized designs
Who You Are (Basic Qualifications)
- PhD in Photonics, Mechanical Engineering, Physics, Optics, or a closely related field
- At least 10 years of industry R&D experience with mechanical design of optoelectronic packages developed and transferred to manufacturing environments
- Hands-on experience with optical alignment of components to submicron tolerances, designing for high thermal power density
- Experience with mechanical design layout with finite element analysis (FEA) understanding (e.g., to calculate stress/design from CTE mismatch, optic misalignment, thermal limits etc.)
- Experience with various optical components (e.g., gratings, mirrors, lenses), stable attachment methods (e.g., epoxy and solder based)
- Expertise in component qualification methodologies (e.g., GR-468), product reliability testing, and statistical analysis tools
- Experience with component and optical-packaging failure modes, with a demonstrated track record in failure mode analysis and resolution
- Experience with New Product Introduction (NPI) methodology: design, verification, qualification, release to manufacturing
- Strong communication skills with suppliers, customers, and cross-functional internal teams
What Will Put You Ahead
For this role, we anticipate paying $200,000- $280,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.
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