Principal Packaging Engineer

Skyworks Solutions Inc

San Jose, CA

JOB DETAILS
SKILLS
Assemblers Technology, Assembly Equipment, Ball Grid Array (BGA), Cadence Allegro, Communication Skills, Cross-Functional, DRC Flows, Electrical Engineering, Failure Analysis, Flip Chip, Incentive Programs, Integrated Circuit (IC) Design, Leadership, Manufacturing, Manufacturing Design, Material Science, Mechanical Engineering, Mentoring, Molding Processes, People Management, Presentation/Verbal Skills, Printed Circuit Board (PCB), Process Engineering, Product Development, Product Support, Product/Service Launch, Production Volume, Project/Program Management, Radio Frequency, Reliability Testing, Research & Development (R&D), SIP (Session Initiation Protocol), Semiconductors, Stock Purchase Plans, Surface Mount Technology, Team Player, Technical Leadership, Technical Support, Wire Bonding, Wireless Communications, Writing Skills
LOCATION
San Jose, CA
POSTED
30+ days ago

Job Description

If you are looking for a challenging and exciting career in the world of technology then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.

Through our broad technology expertise and one of the most extensive product portfolios in the industry we are Connecting Everyone and Everything All the Time.

At Skyworks you will find a fast-paced environment with a strong focus on global collaboration minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 77070

Job Description

We are seeking a Principal Packaging Engineer with expertise in advanced laminate packaging technologies to support new product development NPI of RF System in Package SiP modules. Candidate will be the RF packaging interface between multi-functional groups within Skyworks and internal/external manufacturing.

This position offers significant opportunities for growth including leading strategic packaging initiatives and influencing Skyworks packaging technology roadmap. Leadership experience either as a program manager, people manager, or technical lead is a strong plus.

On-site location is flexible. Desired location in San Jose, CA or Irvine, CA.

Responsibilities

Working with IC design teams to define and implement the package requirements.

Ownership of specific product from feasibility stage to high volume production.

Ensuring that DFMBKM is implemented for assembly yield cost and reliability.

Developing new assembly technologies running process DOEs identifying new materials and equipment reliability testing and qualification of new assembly process.

Required Experience and Skills

BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.

Minimum 12 years experience or MS and 8 years in semiconductor packaging technology.

Strong project management and communication skills (verbal, written, and presentation).

Expertise with overmolded laminate module packaging processes, SMT, Wirebonding, Die Attach, and Molding.

Knowledge of various assembly processes, including Flip Chip, Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.

Experience in Advanced RF SiP Modules, Dual Side BGA, Dual Side Mold, Grid Array, EMI Shielding.

Experience working with OSAT Assembly Factories in Asia.

Desired Experience and Skills

Solid understanding of Design Rules Check and Design for Manufacturing.

Hands-on experience with assembly processes and equipment.

Experience in package design and proficient in Cadence Allegro platform tools, PCB Editor, Advanced Package Designer, APDSiP, or Mentor Xpedition platform tools.

Understanding of RF products and concepts is highly desired.

Experience with Failure Analysis.

Understanding of Module and Board Level Reliability requirements.

Understanding of manufacturing of organic laminate technologies.

Experience with Lead-Frame Packaging.

Prior R&D experience of advanced packaging concepts.

Base Pay Range

The typical base pay range for this role across the U.S. is currently USD129,400 - USD247,800 per year. Starting base pay will depend on relevant experience, skills, training, and education, business needs, market demands, the ultimate job duties and requirements, and work location.

Benefits

Skyworks offers a comprehensive benefits package, including:

  • Access to healthcare benefits, including a premium-free medical plan option
  • A 401k plan and company match
  • An employee stock purchase plan
  • Paid time off, including vacation, sick leave, and wellness leave
  • Parental leave
  • Incentive plan participation
  • Additional awards, including recognition and stock

Equal Opportunity Employer

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.

Accessibility

Skyworks strives to create an accessible workplace. If you need an accommodation due to a disability, please contact us at accommodationsskyworksinc.com.

About the Company

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Skyworks Solutions Inc