Company TSMC Arizona Corporation
Location USA-Arizona
Posted May 07 2026
Job Title Principal Process Engineer - Nano Diffusion 3848
Statement about position companyA job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizonas first fab will operate its leading-edge semiconductor process technology N4 process starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology with production starting by the end of the decade. Americas leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. As a Principal Process Engineer - Nano Diffusion you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values - Integrity Commitment Innovation and Customer Trust. Multiple positions available.
Principal Process Engineer - Nano Diffusion - Brief Description Lead the design and execution of experiments interpreting and extracting insightful results from complex data sets to optimize the manufacturing process and achieve precision control at atomic levels. Work closely with other innovators in device integration defect reduction lithography etch and thin films teams to drive leading-edge integrated module development control and improvements to resolve issues or specific requests from TSMCs customers.
Responsibilities Apply statistics process control methods to establish and sustain a robust manufacturing process. Supervise the installation and maintenance of manufacturing equipment to expand capacity with punctuation and quality. Collaborate effectively with equipment and material suppliers and partners to identify technology gaps and deficiencies devise evaluate and qualify mitigation and continuous improvement solutions. Review and support the work of Process Engineers.
Minimum Qualifications Requirements
Education and Work Experience Must have a Masters degree or foreign equivalent in Chemical Engineering Electrical Engineering Mechanical Engineering Physics Chemistry Materials Science or a related field and 3 years of engineering experience. Alternatively will accept a Bachelors degree or foreign equivalent in Chemical Engineering Electrical Engineering Mechanical Engineering Physics Chemistry Materials Science or a related field and 5 years of postbaccalaureate progressive engineering experience.
Technical Skills Must have 2 years of experience with semiconductor process engineering. Must have 2 years of experience in at least 2 of the following Design of Experiment DOE statistical process control or statistical methods for modeling multivariate data sets. Must have 2 years of experience in at least 2 of the following metrology used in semiconductor processing Transmission Electron Microscopy TEM Scanning Electron Microscopy SEM Critical Dimension SEM CD-SEM Energy Dispersive X-ray Spectroscopy EDS Focused Ion Beam FIB Atomic Force Microscopy AFM X-ray Diffraction XRD Emission Spectroscopy Raman Spectroscopy Spectroscopic Ellipsometry Quartz PCI or Fourier Transform Infrared Spectroscopy FT-IR. Must have 2 years of experience in at least 3 of the following wafer cross section techniques wafer fabrication processes ion transport phenomena dynamic random-access memory DRAM plasma etching plasma simulation semiconductor thin film deposition Atomic Layer Deposition ALD 3D NAND Flash Chemical Vapor Deposition CVD or Plasma Enhanced Chemical Vapor Deposition PECVD. Must have 1 year of experience leading projects and providing career and performance feedback to junior engineers and technicians. Must have 1 year of experience in semiconductor 28nm-4nm tech node ion implant technology transfer and production line setup experience. Must have 1 year of experience with implant dose measurement equipment installation qualification and maintenance capabilities. Must have 1 year of experience in managing semiconductor process material costs usage control and 2nd source CIP evaluation.
Physical Requirements Candidates must be willing and able to work on-site at our Phoenix Arizona facility. Standard Work Hours 40 hrsweek Mon-Fri 830 a.m. - 530 p.m.
As a valued member of the TSMC family we place a significant focus on your health and well-being. When you are at your best-physically mentally and financially-our company is at its best. We offer a comprehensive and competitive benefits program that provides the resources you need to help you manage your health and achieve your goals across many areas of your life. This includes a variety of medical dental and vision plan offerings you can choose from that best fit you and your familys needs. Additionally TSMC provides income-protection programs to financially assist you should you experience an injury or illness and a 401k-retirement savings plan to help you secure your financial future. TSMC also offers competitive paid time-off programs and paid holidays allowing you to recharge and spend time with your family and loved ones.
Work Location 5088 W. Innovation Circle Phoenix AZ 85083
TSMC is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race color religion age sex sexual orientation gender identity national origin disability veteran status or any other protected characteristic. We encourage all qualified individuals to apply and we welcome applications from individuals with diverse backgrounds and experiences. Candidates must be able to perform the essential functions of the job with or without a reasonable accommodation. If you need a reasonable accommodation as part of this application process please contact P_LOAtsmc.com.
Requisition 3848