Join a highly innovative engineering organization building next‑generation semiconductor capital equipment components and sub-assemblies. As a Principal Systems/Mechanical Engineer, you will analyze, improve, and define subsystem architectures that directly influence system performance, throughput, and reliability for customers at the forefront of semiconductor equipment manufacturing.We are seeking a highly skilled Principal Systems/Mechanical Engineer, Semiconductor to lead the design and integration of complex subsystems used in advanced semiconductor capital equipment.You will architect mechanical, thermal, fluid, and structural solutions that drive system performance and reliability, working closely with customers and cross‑functional teams across the full product lifecycle.This is a high‑impact technical leadership role with significant influence over subsystem architecture, innovation, and customer success.What will you do? This role partners with the business unit, world‑class customers, engineering centers, operational sites, and strategic suppliers globally to solve complex multidisciplinary design, manufacturing, and supply chain challenges. Specific examples include:Co-Innovation Through Subsystem Architecture & Design Analyze, refine, architect and design mechanical subsystems including robotics/mechatronics, vacuum and gas delivery, power systems, and precision mechanical assemblies.Develop detailed CAD models and engineering drawings for weldments, sheet metal, machined parts, and assemblies.Analyze, refine, and define system and subsystem interfaces, requirements, and specifications.Develop and maintain interface control documents (ICDs).Lead requirements decomposition and ensure bi-directional traceability.Establish subsystem validation strategies and verification plans.Analysis & Verification Perform structural, thermal, dynamic, and vacuum-related analyses using advanced FEA tools.Lead risk assessments including FMEAs, root cause analysis, and structured problem‑solving.Validate system reliability through load‑path evaluation, stress analysis, fatigue modeling, and environmental considerations.Technical Leadership & Cross‑Functional Integration Lead cross‑functional design reviews and drive subsystem integration, optimization, and design validation.Collaborate with global teams, suppliers, and customers to refine requirements and resolve technical issues.Champion DFX, VAVE, Lean methodologies, and continuous improvement initiatives.Mentor early‑career engineers, elevate technical standards, and influence engineering culture by role modeling key attributes of leadership and ownership.Make high‑impact technical decisions that influence product performance and industry competitiveness.Represent engineering in customer engagements and roadmap discussions.Lifecycle, Compliance & Supply Chain Support Support NPI, RFQ processes, qualification testing, and component lifecycle management.Ensure design compliance with global regulatory standards (UL, CE, RoHS, REACH).Develop and maintain robust documentation including BOMs, specifications, test plans, qual plans, and ECOs.Partner with product management, operations, supply chain, and finance to ensure solutions meet cost, reliability, and schedule targets.How will you get here? Required Bachelor's degree in mechanical, systems, or related engineering field.5+ years experience in semiconductor capital equipment or wafer‑fab, advanced packaging environments.Expertise in mechanical design, precision systems engineering, mechatronics, power systems, and fluid/vacuum systems.Proficiency in FEA, CAD, and structural/thermal analysis tools.Strong communication, documentation, and cross‑functional collaboration skills.Demonstrated ability to lead reviews, guide teams, and interface with customers.Ability to travel domestically and internationally up to 30%.Preferred MS in mechanical or systems engineeringExperience in semiconductor mechanical system designHands‑on prototyping and global supplier engagement#J-18808-Ljbffr