Principal Technologist

ASM
  • Boise, Idaho
    30+ days ago

    Job Description

     

    Step into a career with ASM, where cutting edge technology meets collaborative culture.

    For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  


     

    Job Responsibilities 

    • Lead advanced packaging technology engagement for key customer new products/applications penetration. 
    • To maintain sustain application position with customer R&D and HVM teams (Ensure HVM feedback is accounted for in future defense of process wins). 
    • Drive module process and equipment fundamental improvements to ensure we meet customer needs and win applications. 
    • Define overall NPI program schedules, align on, and drive required execution plans and program deliverables to completion while meeting critical milestones (customer’s roadmap) 
    • Proactively identify talent and continuously develop team members with a deliberate roadmap. 
    • Develop metrics to measure NPI program performance and to drive improvement through successive product introduction. 
    • Build strong cross-functional and matrixed relationships and collaborate with Product Marketing, Product Development, Service Engineering, and others to ensure a positive customer experience. 

     

    Education & Experience: 

    • Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field. 
    • 15+ years(bachelor) or 12+years(M.S./Dr.) of experience in the semiconductor field, especially in Thin Film/PECVD/LPCVD/ALD module process development. Tool vendor experience is plus. 
    • Strong project management and analytical skills. 
    • Proven success in building collaborative partnerships with customers and internal organizations. 
    • Effective English oral and written communication skills.
    • Strong leadership qualities to exercise influence both throughout the organization and with BU/Service Team. 
    • Goal and customer oriented.
    • Positive and energetic attitude with strong work ethic and initiative. 

     

    Numbers & Facts

    LocationBoise, Idaho
    Websitehttps://www.asm.com/open-vacancies/

    Skills

    • Analysis Skillsunmatched
    • Applications Securityunmatched
    • Artificial Intelligence (AI)unmatched
    • Autonomous Driving Systemsunmatched
    • Chemical Engineeringunmatched
    • Chemical Physicsunmatched
    • Cloud Computingunmatched
    • Communication Skillsunmatched
    • Cross-Functionalunmatched
    • Customer Experienceunmatched
    • Customer Relationsunmatched
    • Diversityunmatched
    • Electrical Engineeringunmatched
    • English Languageunmatched
    • Leadershipunmatched
    • Leading Edge Technologyunmatched
    • Material Scienceunmatched
    • Metricsunmatched
    • Presentation/Verbal Skillsunmatched
    • Process Developmentunmatched
    • Process Improvementunmatched
    • Product Developmentunmatched
    • Product Marketingunmatched
    • Product/Service Launchunmatched
    • Project/Program Managementunmatched
    • Research & Development (R&D)unmatched
    • Schedule Developmentunmatched
    • Semiconductorsunmatched
    • Software Administrationunmatched
    • Sustainabilityunmatched
    • Team Playerunmatched
    • Thin Filmunmatched
    • Writing Skillsunmatched

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