Process Development Engineer

Position Summary:We are looking for a hardworking, and passionate Process Development Engineer for our Florida Advanced Packaging site. This role will focus on owning and developing the Lamination area within our Advanced Packaging product line. Candidates with experience in semiconductor manufacturing, backend‑of‑line processing, or advanced packaging are well suited. In this role, you will lead, develop, and improve integrated process flows and collaborate closely with foundry customers, colleagues, and management. Strong communication skills are essential.Major Area of Accountability:• Lead new process development, transfer, and integration activities in a manufacturing environment related to Lamination processes.• Develop, optimize, and integrate robust manufacturable process recipes for Foundry customers in the Lamination area.• Provide technical ownership for the assigned module, including process stability, tool performance, defectivity, consumables evaluation, and continuous improvement.• Support process integration for advanced packaging, MEMS, Photonic, or backend‑of‑line device flows.• Utilize metrology and characterization tools to evaluate process conditions and drive improvements.• Investigate and implement integration or process‑flow changes to improve device performance, reliability, and yield.• Work with process and equipment engineers to identify processing marginalities and implement corrective actions.• Monitor in‑line and end‑of‑line SPC charts for trends/excursions and drive data‑based corrective actions.• Support improvement of electrical test parametrics through process/integration modifications.• Opportunity to grow toward Project Management responsibilities, integrating customer device or process requests.• Perform other duties as assigned. Percentages of time spent on specific job duties may vary.Required Qualifications:Education: Bachelor's degree in Engineering or another STEM discipline preferred; equivalent technical experience considered.Experience and Skills:

• 0-2 years of hands‑on experience with fab processing tools in at least one semiconductor or advanced packaging process area.• Knowledge of MEMS/Photonic devices or backend‑of‑line integration is a plus.• Strong understanding of DOE, SPC, and 6‑sigma concepts and their application.• Project management skills or formal training are beneficial.• Clear, data‑driven problem‑solving capability with strong communication and documentation skills.• Ability to work independently and in cross‑functional teams.US Citizenship Required:This position will require holding or the ability to obtain a government security clearance, which requires U.S. citizenship.