Process Development Engineer - PackagingLocationEmployment TypeFull-timeDepartmentAbout the CompanyInlighten Technologies is a Silicon Valley startup developing next-generation microLED technologies for augmented reality (AR) and AI-powered smart glasses. Our mission is to push the limits of microLED performance and manufacturing, enabling scalable, mass‑market production. Join us to help create the displays that will power the future of immersive computing.DescriptionWe are seeking a Process Development Engineer - Packaging, to support the development and mass production of microLED AR light engines. This role will focus on advanced packaging processes, including die bonding, interconnection, optical integration, and reliability, working closely with device, optics, and system teams to transition technologies from R&D to volume manufacturing.Key ResponsibilitiesDevelop, optimize, and qualify packaging processes for microLED AR light engines.Lead process development for: MicroLED die bonding with FPC/PCB, Interconnect technologies, Wafer-level or panel-level packaging, Optical component integration (waveguides, collimators, micro-optics, etc.)Define process flows, DOEs, and control plans for new packaging technologiesDrive yield improvement, defect reduction, and cost optimizationSupport EVT / DVT / PVT builds and ramp to mass productionPerform failure analysis and root cause investigations related to packaging and assemblyCollaborate with device, optics, system, equipment, and manufacturing teamsWork with equipment vendors and material suppliersGenerate and maintain process documentation, specifications, and qualification reportsMinimum QualificationsBachelor's degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, or related field3-7 years of experience in advanced packaging or process developmentStrong understanding of semiconductor and optoelectronic packaging processesHands‑on experience with die attach, bonding, interconnect, and assembly processesExperience running DOE, process characterization, and data analysisFamiliarity with yield, reliability, and manufacturing metricsAbility to work in a cross-functional, fast-paced R&D-to-production environmentAbility and willingness to travel internationally up to 20%Preferred QualificationsAdvanced degree (MS or PhD) in a relevant field of study.Direct experience with microLED, LED, or CIS packagingExperience in AR light engines or optical module packagingFamiliarity with reliability testing (thermal cycling, HTOL, humidity, drop, etc.)Hands‑on experience with process yields analysis and defect characterizationSalary Range: $104k - $208k/yearComprehensive health, dental, and vision insurance.Paid holidays and vacationInlighten Technologies is an equal opportunity employer that is committed to inclusion and diversity. We promote equal opportunity for all applicants without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, disability, veteran status, or any other legally protected characteristics.#J-18808-Ljbffr