Process Engineer - Advanced Semiconductor Packaging

OverviewKeysight is at the forefront of technology innovation, delivering breakthroughs in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world‑class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in more than 100 countries.Keysight's HFTC, located in Sonoma County, Santa Rosa, California, is a world‑class semiconductor organization that invents, designs, and manufactures state‑of‑the‑art custom integrated circuits (ICs) to enable industry‑leading test and measurement solutions. HFTC's proprietary indium phosphide (InP) and gallium arsenide (GaAs) platforms make possible some of the world's highest‑speed and highest‑frequency Monolithic Microwave Integrated Circuits (MMICs). The 50,000‑sq‑foot micro‑fabrication facility and deep expertise in IC design and advanced compound semiconductor manufacturing provide a distinct competitive advantage in performance.ResponsibilitiesWe focus on process research and development, process integration, and new product introduction. You will lead the development of next‑generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.Key ResponsibilitiesDevelop and maintain wafer fabrication processesDevelop and maintain package assembly processesSpecify, select and qualify new equipmentContribute to process automationReview new designs for manufacturability and provide feedback to module designersUnderstand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targetsLead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teamsMeet accelerated project schedules; communicate and manage risksDevelop and maintain high yields while adhering to project schedulesQualificationsBS, MS, or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields with 2–5+ years of applicable experience in semiconductor fabrication/advanced packaging processes.We are seeking an industry professional with proven expertise in three or more of the following areas:Design for manufacturing of electromechanical assembliesStatistical process control (SPC), design of experiments (DOE)Thermocompression / flip‑chip bondingSurface Mount Technology (SMT) processesDie singulationSemiconductor fabrication processesHeterogeneous integration, advanced packaging techniquesNew technology introductionNew product introductionProfessional Experience DesiredIII‑V compound semiconductors and/or silicon technologiesThermal, mechanical and electrical reliabilityTechnical project management, project lifecycleLocation & EligibilityCandidates must be local or willing to relocate to Santa Rosa, CA. This role requires access to export‑controlled items. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or a protected individual with authorization from the U.S. government for export‑controlled items under 8 U.S.C. 1324b(a)(3).Keysight is an Equal Opportunity Employer.SalarySanta Rosa, CA: $126,930 – $169,240 – $211,550BenefitsMedical, dental and visionHealth Savings AccountHealth Care and Dependent Care Flexible Spending AccountsLife, Accident, Disability insuranceBusiness Travel Accident and Business Travel Health401(k) PlanFlexible Time Off, Paid HolidaysPaid Family LeaveDiscounts, PerksTuition ReimbursementAdoption AssistanceESPP (Employee Stock Purchase Plan)Restricted Stock Units#J-18808-Ljbffr