Maintaining the FPYR, OEE and scrap performance in power circuit board assembly (PCBA) processes. Provides technical support to production and other related functions.
Key Responsibilities
Sets up and programs SMT and DIP Machines for the new product up to mass production.
Conducts process optimization, time study and defect analysis.
Generates daily and weekly yield and OEE performance report.
Presents daily and weekly reports (Yield, OEE, Scrap, Customer claim).
Conducts process and product evaluation.
Trains newly hired engineers and technicians to SMT and DIP Process.
Provide process documentation and operating instructions in SMT and DIP Process.
Collects data, writes reports, and presenting findings to management.
Runs risk assessment and process being used.
Conducts buy-ff qualification of newly acquired fixtures, material or product.
Qualifications
Bachelor's degree in electrical engineering, mechanical engineering or related field
Minimum 2 years of experience in other similar engineering job, including hands-on involvement in product and process design, testing, development and manufacturing processes.
In-depth knowledge on PCBA process, equipment, customer requirements and other 3rd party requirements such as ISO 9001, AITF, IPC, regulatory standards, and manufacturing processes.
Knowledge in statistical tools such as PowerBI, Minitab, Excel, CAM, Valor, CAD as well as SPC and DOE
Problem-Solving Abilities: Demonstrated ability to identify process or equipment issues, analyze root causes, and develop effective solutions
Proven experience in managing NPI projects from pilot to mass production, including defining project scope, creating project plans, allocating resources, and tracking progress.