The Product Engineer will lead cross‑functional teams to investigate yield excursions, identify root causes, and implement timely corrective and preventive actions (CAPA) using industry‑standard engineering methodologies. You will own yield bridge activities, supporting both new product introduction (NPI) and the transition to high‑volume manufacturing, ensuring robust process scalability and sustained yield performance.
Success in this role requires strong analytical capabilities, including the ability to perform complex data queries, statistical analyses, and commonality studies to drive effective troubleshooting and continuous yield improvement. The ideal candidate is detail‑oriented, data‑driven, and thrives in a fast‑paced environment focused on advanced photonics technology.
Responsibilities
Support daily production like solving issues in real-time, as well as leading the analysis of failures on the wafer fabrication and testing production line.
Work closely with R&D team to support new product introduction on next generation optoelectronic chips such as VCSEL, DFB laser, detector and photonic integrated chips for 3D sensing application.
Perform design/process sensitivity study to define EPI/process spec limits. Coordinate correlation study between Chip, optical sub-assembly and transceiver modules to enhance design for manufacturability.
Lead the efforts to drive production ramp-up readiness. Coordinate with cross-functional team (EPI, process, assembly, test etc) to ensure manufacturing readiness of chip design and specs, new equipment's, process flow and specs, documentation and test database infrastructure etc.
Lead cross-functional team to drive yield improvement and product cost reduction postproduction ramp. Perform statistical data analysis and trouble shoot potential root causes for yield excursions.
Work closely with optical sub-assembly and transceiver module team to address issues at contract manufacturer that could be related to chip performance.
Support cost modeling and facilitates actions / decisions towards designing and delivering cost-competitive products.
Skills and other requirements
Hands-on experience with design, process, and characterization of optoelectronic device such as VCSEL, DFB laser, or photonic integrated chip.
Strong statistical data analysis skills (JMP or Minitab etc.).
Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process, and quality control, change management etc.) in a high-volume manufacturing environment is a plus.
Experience with optoelectronic device reliability testing and modeling is a plus.
Strong communication skills; adept at hosting effective meetings and facilitating actions and resolving conflicts.
Strong ability to drive actions and solutions through cross-functional teams.
Education & Experience
Skills
Working Conditions
Physical Requirements
Safety Requirements
Quality and Environmental Responsibilities
Culture Commitment
Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com.
| Location | Sherman, TX |
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