Production Operator - R

3 Departments Interviewing 3rd shift 11pm-7:30am

Plating
Candidate good product inspection abilities and strong communication skills.   
This is a mix of some physical lifting, such as lifting up to 50lbs intermittently,(often lighter)
along with the a software driven system via tablet or touch screen. Good computer skills
are recommended.  All work centers in the 3DI plating area require using barcode scanners for tracking and recipe
retrieval.

AOI,
Candidate should possess good computer skills, visual product inspection abilities
and strong communication skills.   This is a software driven inspection system.  Attention
to detail with a focus on spatial awareness is a plus. All work centers in the 3DI plating area require using barcode
scanners for tracking and recipe retrieval.

Mech,
Candidate should possess good computer skills, visual product inspection abilities
and strong communication skills.   This is a machine and light software driven system
along with the use of an epoxy paste for via fill.  Neatness and agility are a plus.
All work centers in the 3DI plating area require using barcode scanners for tracking and recipe
retrieval.

Working from written or verbal instructions, perform assembly and test related tasks on automated VI Chip PCB Assembly line.
ResponsibilitiesOperate work center equipment to achieve standard production rates, report on equipment downtime or malfunction and monitor work center output for conformance to specification.
Utilize microscopes, hand tools, measurement and test equipment to perform daily tasks.
Cross-train and certify in a minimum of four package assembly work centers including SMD, Underfill, Transformer Assembly, Mold, Laser Mark, Cut, J-Lead or Test.
Perform all responsibilities within the company’s guidelines of quality, safety and cost.
Work with a minimum of direct supervision.
Perform any additional tasks as requested or directed.