Prototyping, Detail Oriented, Flip Chip, Laboratory Management, Radio Frequency, Soldering, User Interface/Experience (UI/UX), Wire Bonding,
Required Qualifications
- Minimum of 5 years of hands-on experience in manual rework, prototype assembly, or evaluation board assembly for mobile, RF, or high-density electronic applications.
- Strong manual dexterity and ability to perform precise soldering, component replacement, and microscope-based rework.
- Experience with multi-layer PCBs, integrated circuits, fine-pitch components, and intricately interconnected PCB designs.
- Ability to read and follow schematics, assembly drawings, prints, work instructions, and engineering notes.
- Strong communication, organization, accountability, teamwork, and proficiency with email, web-based applications, and task management systems.
Key Responsibilities
- Rework evaluation boards and RF front-end modules used in mobile applications, including desoldering and resoldering GaAs or SOI die, 01005 components, and other fine-pitch devices.
- Perform precision soldering, reflow, manual flip-chip assembly, wire bonding, component replacement, and microscope-based inspection.
- Support engineering debug, tuning, prototype iterations, and board- or module-level modifications.
- Follow schematics, assembly drawings, process instructions, rework documentation, and engineering direction.
- Communicate technical issues, repair status, and process concerns clearly with engineering team members.
- Follow ESD protocols, maintain accurate records, use web-based task systems, and stay current on surface mount technologies and repair techniques.
Prototype Assembler/Wire Bonder
Temp to Perm
1ST Shift 7AM-3:30PM
Pay rate: $28-40 PER HOUR
Position Summary
We are seeking a highly skilled, detail-oriented Prototype Assembler to support RF module development, prototype builds, evaluation board rework, and RF front-end module modifications in an ESD-controlled engineering lab. This role requires strong hands-on experience with precision soldering, microscope-based inspection, fine-pitch components, GaAs or SOI die, 01005 components, manual flip-chip assembly, and wire bonding.
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PLS Staffing Solutions, Inc