Reliability/FA Engineer 2 (Austin, TX, US)

Description

As an Engineer 2, you will develop, analyze, and report laboratory results to isolate failures at the electronic module, component, and device level. You will work closely with Quality, Test, and Design engineering teams to select and apply appropriate failure analysis tools and techniques to identify root cause of product issues. 

You will recommend test methods and laboratory control procedures to improve fault isolation and root cause identification. You will develop an understanding of product reliability requirements to ensure compliance with company, customer, and regulatory standards. 

Additionally, you will develop new analytical techniques to enable early detection of risks in products, packaging, and manufacturing processes. You will provide data-driven recommendations to improve product reliability, including potential design or process enhancements.

Responsibilities

• Devise and execute parametric and functional testing using bench setups and system-level test configurations.
• Perform data analysis and troubleshoot electronic components, including semiconductor devices, surface mount components, printed circuit boards, and advanced packaging such as wire-bond and flip-chip assemblies.
• Collaborate closely with Quality, Reliability, and Design engineering teams to isolate failures and determine root cause, while developing and improving failure analysis methodologies and laboratory procedures.
• Apply and support engineering analysis across key product domains, including Broadcast Video products, Broadcast Audio products, Power and Timing products. Document and communicate findings clearly and effectively to cross-functional teams. 

Required Experience and Skills

• A BS degree in Electrical Engineering or Computer Engineering with two or more years of experience, or an MS degree with no prior experience
• Candidates should have a strong understanding of electrical circuit fundamentals, semiconductor physics and digital and analog electronics, along with the ability to troubleshoot and debug complex hardware systems and test setups.
• Experience with printed circuit board schematic capture and layout tools is expected.
• Strong analytical and problem-solving skills are essential, along with excellent written and verbal communication skills to effectively present technical findings to diverse audiences.
• Proficiency in Microsoft Office tools including Outlook, Word, Excel, and PowerPoint is also required. 

Desired Experience and Skills

• Familiarity with failure analysis tools and techniques is highly desirable, including optical microscopy (visible, near-infrared, and infrared), X-ray and CT imaging, scanning electron microscopy (SEM), and acoustic microscopy (CSAM).
• Experience with sample preparation techniques such as mechanical polishing and wet or dry etching is also beneficial.
• Additional experience working with electronic test equipment and performing measurements in a laboratory environment is valued.
• Candidates should demonstrate strong collaboration skills, the ability to multitask, the ability to build effective working relationships across teams, and a positive attitude with eagerness to learn and adapt to new technical challenges. 

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