Research Scientist - RFMixed-Signal Packaging and Module Design

IBM Quantum is hiring a Research Scientist to contribute to the development of advanced, high-performance RF and mixed-signal single-chip and multi-chip modules (MCMs) for exploratory applications. We focus on differentiated solutions for a range of communication and computation challenges, including the creation of CMOS-based electronics for quantum computing applications. Successful applicants will have demonstrated experience in the development of complex packaging solutions for RF and mixed-signal functions. In this role, you may be tasked with designing packages that support RFICs, high-speed digital interfaces, and high-density interconnects. Various substrate technologies can be used for these designs including organic laminates and Si-based interposers. The design process will include EM simulation, package-IC co-simulation, and signal integrity and power integrity analysis (SI/PI). You will work in close collaboration with IC and system designers and be involved in all aspects of design projects from concept and module architecture exploration/definition to bring up and test; demonstrated hands-on lab skills are therefore important. In addition, background in communication theory and systems and/or quantum computing would be advantageous.