Semiconductor Process Applications Engineer

Job description\n

Position Overview

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We are seeking an experienced and highly motivated Semiconductor Process Applications Engineer to join our team. We are a leading capital equipment company specializing in sub-micron die bonding solutions for the semiconductor industry. This role is ideal for professionals with several years of hands-on experience in semiconductor manufacturing and advanced packaging processes. The successful candidate will play a key role in supporting our sales team, interfacing with our customers, and driving technical success for our cutting-edge, die-bonding equipment.

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Key Responsibilities

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• Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies like quantum computing and brain-machine interface.
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• Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities.
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• Collaborate with customers to understand application requirements and develop customized process solutions.
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• Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically.
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• Provide technical training to customers and internal staff on equipment operation and process optimization.
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• Gather customer feedback and work with international engineering teams to drive product improvements and new feature development.
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• Prepare and maintain technical documentation, including application notes, process guidelines, and training materials.
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• Represent the company at industry events, conferences, and customer meetings as a technical expert.
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Qualifications

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• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
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• Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering.
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• Proven expertise working with die bonding, wire bonding, or related semiconductor assembly equipment.
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• Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization.
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• Excellent problem-solving skills and the ability to troubleshoot complex hardware and process issues.
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• Outstanding communication and interpersonal skills; ability to present technical information clearly to diverse audiences.
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• Able to work daily from our office and demo lab in Chandler, AZ. Willingness to travel domestically and internationally as required (up to 30%).
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Preferred Skills

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• Customer-focused mindset with a proactive approach to solving challenges.
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• Team player able to collaborate across departments and with external partners.
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• Adaptable and eager to learn about new technologies and industry trends.
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• Self-motivated, organized, and able to manage multiple priorities effectively.
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• Familiarity with advanced packaging trends such as flip-chip, wafer-level bonding, and heterogeneous integration.
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Why Join Us?

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Become part of an innovative, close-knit team at the forefront of semiconductor assembly technology. You will have the opportunity to make a tangible impact on the industry, work with cutting-edge equipment, and advance your career in a collaborative environment that offers a competitive salary and a comprehensive benefits package.

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