Senior EM/IR Engineer

• Lead EM/IR drop analysis for complex SoC designs at block and full-chip levels across all process corners

• Define and implement power delivery network (PDN) strategy to meet EM/IR sign-off requirements

• Perform static and dynamic IR-drop analysis and work with physical design teams to implement power grid improvements

• Analyze electromigration violations and develop mitigation strategies for metal and via connections

• Collaborate with physical design engineers to optimize power grid density, via stacking, and decap placement

• Develop and maintain EM/IR analysis flows, scripts, and automation infrastructure

• Work with foundry design rules and reliability specifications to ensure sign-off compliance

• Define power intent (UPF/CPF) requirements and validate implementation against power management intent

• Provide power analysis results and recommendations to design leadership and cross-functional teams

• Document EM/IR methodology guidelines, best practices, and sign-off reports

• Minimum 8+ years of experience in EM/IR analysis and power integrity for complex ASICs or SoCs

• Hands-on proficiency with industry-standard EM/IR tools such as Cadence Voltus, Synopsys RedHawk, or equivalent

• Deep understanding of power delivery network design, power grid analysis, and IR-drop mitigation techniques

• Strong knowledge of electromigration physics, EM rules, and reliability analysis methodologies

• Experience with both static and dynamic power analysis including vectorless and vector-based approaches

• Solid understanding of low-power design techniques and their interaction with power integrity

• Proficiency in scripting (Tcl, Python) for EM/IR flow development and result automation

• Familiarity with advanced process node design rules and foundry reliability specifications

• Excellent ability to communicate complex analysis results clearly to cross-functional teams

• Experience with 7nm or sub-7nm EM/IR sign-off requirements

• Exposure to thermal analysis and electro-thermal co-simulation

• Familiarity with package-level power integrity and chip-package co-design

• Experience with advanced power management architectures (DVFS, multiple voltage domains, retention)

• Background in satellite communication, 5G, or high-reliability IoT chip design

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.