About Analog DevicesAnalog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.Position OverviewWe seek a highly motivated Senior Packaging Engineer to drive package development and deployment within our New Product Introduction (NPI) pipeline. This role will work closely with Business Units, global operations, and external partners to deliver robust, scalable NPI packaging solutions while enabling supply chain resilience and continuous improvement in our development systems.Key ResponsibilitiesNPI Package DevelopmentPartner with Business Units to define, develop, and release semiconductor packaging solutions as part of the NPI pipelineDrive package design, qualification, and production readiness to meet performance, cost, and schedule requirementsCross-Functional CollaborationWork closely with design, reliability, QA, and operations teams to ensure seamless product introductionInterface with global subcontractor partners, particularly in Asia, to execute development and production plansSupply Chain & Operations SupportSupport and lead operations-initiated projects focused on supply chain resiliency, cost optimization, and dual-sourcing strategiesIdentify and mitigate packaging-related risks across the supply baseSystems & Process DevelopmentContribute to the architecture and continuous improvement of NPI systems and workflowsHelp define best practices for package release, change management, and data integrityData & AnalyticsUtilize data-driven approaches to improve development cycle time and decision-makingWork with assembly master data and leverage insights using data analytics platforms such as KNIMERequired QualificationsMaster's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Applied Physics or related field3-4 years of experience in a fast-paced microelectronics or semiconductor packaging environmentStrong understanding of semiconductor assembly processes and package qualification methodologiesExperience working in fast paced cross-functional, global development environmentsDemonstrated ability to drive projects from concept through productionExperience in use of 2D AutoCAD. 3D CAD tools a plus.Preferred QualificationsExperience in systems integration and/or NPI systems developmentFamiliarity with assembly master data structures and change management processesFamiliarity with data analytics tools such as KNIME or RDBMS systems.Experience working with OSATs / subcontractor ecosystems, particularly in AsiaExperience with simulation tools like Flotherm and ANSYS, and MS Office toolsKey Skills & AttributesStrong problem-solving and analytical skillsSelf-starter, ability to operate effectively in a fast-paced environmentExcellent communication and stakeholder management skillsResults-oriented with a focus on execution, impact and continuous improvementWhy Join UsThis role offers the opportunity to influence both product development and the systems that enable it, working at the intersection of engineering, operations, and strategy in a high-impact environment.For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.EEO is the Law: Notice of Applicant Rights Under the Law.Job Req Type: ExperiencedRequired Travel: Yes, 10% of the timeShift Type: 1st Shift/DaysThe expected wage range for a new hire into this position is $109,940 to $151,168.Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.#J-18808-Ljbffr