A rapidly growing consumer hardware and AI company is seeking a Senior Firmware Engineer, Connectivity, to join their full-time engineering team. This role can be based in the United States and focuses on building next-generation connected devices that blend embedded systems, cloud technology, and machine learning. The ideal candidate will bring deep expertise in Bluetooth Low Energy (BLE), embedded development in C/C++, and wireless device architecture while helping scale a globally deployed product platform.
This is a unique opportunity to become the primary technical owner of wireless connectivity for a category-defining consumer product. The engineer joining this team will influence architecture decisions, firmware update strategy, power optimization efforts, manufacturing validation, and customer-facing reliability initiatives. Candidates who enjoy solving difficult challenges across firmware, RF, hardware, and mobile environments will find significant growth opportunities and ownership in this position.
Required Skills & Experience- · 5+ years of embedded software or firmware engineering experience
- 3+ years building and shipping BLE-enabled products
- Strong understanding of Bluetooth protocols including GAP, GATT, L2CAP, SMP, and BLE security
- Expertise with C and/or C++ development on microcontrollers
- Experience with embedded peripherals including UART, SPI, I2C, and DMA
- Hands-on debugging experience using oscilloscopes, logic analyzers, and protocol sniffers
- Experience deploying OTA firmware updates in production environments
- Knowledge of low-power device optimization techniques
Desired Skills & Experience- Nordic Semiconductor platform experience
- Zephyr or nRF Connect SDK experience
- Consumer electronics or IoT product experience
- Secure boot and embedded security knowledge
- Regulatory certification experience (FCC, CE, Bluetooth SIG)
- Manufacturing support experience
- Python or Node.js tooling experience
- Multi-device BLE architecture expertise
What You Will Be Doing
Tech Breakdown
- 70% Embedded Firmware Development
- 20% Wireless Connectivity & RF Optimization
- 10% Automation, Tooling & Testing
Daily Responsibilities
- 80% Hands-On Engineering
- 5% Leadership & Mentorship
- 15% Cross-Functional Collaboration
The Offer
You will receive the following benefits:
- Medical, Dental, and Vision Insurance
- Vacation Time
- Stock Options
Applicants must be currently authorized to work in the US on a full-time basis now and in the future.
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