Qualcomm is looking for a highly motivated Staff Packaging Engineer in San Diego to lead the development of advanced integrated circuit packaging. The candidate will ensure the transfer of technologies into high-volume manufacturing while solving complex technical problems and collaborating with multiple suppliers.The role requires extensive expertise in Flip Chip, Wire Bond, and SiP assembly processes, along with a Bachelor's or higher degree in engineering. A competitive salary range from $127,200 to $190,800 along with a comprehensive benefits package is offered.#J-18808-Ljbffr