Broadcom Inc. is looking for an experienced IC Packaging Engineer based in San Jose, California. This role involves driving next-generation package architecture, design, and productization using advanced node silicon. You'll collaborate closely with chip design, system design, and manufacturing teams to deliver industry-leading package solutions.With a strong educational background in engineering and extensive hands-on experience in advanced IC packaging, you will manage packaging deliverables, ensuring optimal design and execution throughout the lifecycle.#J-18808-Ljbffr