Senior IC Packaging Reliability Engineer - 2.5D/3D & BGA

NVIDIA Gruppe

Santa Clara, CA

JOB DETAILS
SALARY
$168,000–$264,500 Per Year
SKILLS
Analysis Skills, Ball Grid Array (BGA), Integrated Circuit Packaging, Joint Electron Device Engineering Council (JEDEC), Reliability Engineering, Requirements Management, Semiconductors
LOCATION
Santa Clara, CA
POSTED
Today

NVIDIA Gruppe is seeking an experienced professional to lead package-level reliability for semiconductor products in Santa Clara, California. The ideal candidate will possess a Master's or PhD in a related field, along with 8+ years of hands-on experience in IC packaging and board level reliability, including familiarity with JEDEC standards.This role demands strong analytical skills to define qualification requirements, collaborate across teams, and ensure product reliability. The position offers a competitive salary range of $168,000 - $264,500 for Level 4 and $196,000 - $310,500 for Level 5, along with equity and benefits.#J-18808-Ljbffr

About the Company

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NVIDIA Gruppe