pSemi Corporation, a Murata company, seeks a seasoned packaging engineer to lead design and development of bump, package, and assembly processes for high-volume, high-reliability applications across industrial, automotive, and commercial sectors.You will drive roadmap alignment, explore new packaging technologies, develop manufacturing processes, and mentor junior engineers while collaborating with wafer fabs and external partners to mitigate risk and ensure on-time delivery.#J-18808-Ljbffr