Senior Packaging Architect Substrate & IC Integration

Dormont Manufacturing Company

Phoenix, AZ

JOB DETAILS
SALARY
$220,920–$311,890 Per Year
SKILLS
Integrated Circuits (ICs), Manufacturing, Process Improvement, Product Packaging, Semiconductors, Substrate Design
LOCATION
Phoenix, AZ
POSTED
3 days ago

Dormont Manufacturing Co in Phoenix, Arizona is searching for a seasoned engineer specializing in substrate design and semiconductor packaging. You'll drive the development processes ensuring optimal performance while collaborating with silicon and hardware teams.The ideal candidate will possess a Ph.D. or master's in engineering and over 10 years of relevant experience. Join us for a rewarding career with competitive pay and comprehensive benefits package.Annual salary ranges from $220,920 to $311,890, reflecting your skills and location.#J-18808-Ljbffr

About the Company

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Dormont Manufacturing Company