A leading electronic design automation company is seeking an experienced technical leader to develop advanced packaging and 3DIC analysis flows. The role requires a bachelor's degree, at least 15 years of experience in Signal Integrity and Power Integrity, and strong knowledge of advanced packaging concepts. Candidates should have excellent communication skills and a proactive approach to technical challenges. This is a remote position open to those located in the US, with a competitive salary package and incentives.#J-18808-Ljbffr