Senior Process Engineer - Deposition

Primary Responsibilities 

1. New Process & Tool Development 

• End-to-End Development: Design and execute recipes for new thin-film applications, ensuring strict adherence to required material properties (mechanical, optical and electrical characteristics). 
• Integration Collaboration: Partner with the integration team to ensure surface engineering solutions meet functional requirements for complex devices  
• Tool Qualification: Lead the technical evaluation, installation, and testing of new capital equipment to meet production-ready standards. 
• DOE & Optimization: Design and execute Design of Experiments (DOE) to determine process windows and optimize results. Strong fundamentals in data analysis and demonstrated critical thinking skills  

2. Advanced Troubleshooting & Root Cause Analysis 

• Early-Stage & Production Support: Identify and resolve fundamental process instabilities during early-stage R&D while maintaining the discipline to lead "Task Force" efforts for chronic production excursions. 
• Hardware-Process Mastery: Act as the primary technical expert for resolving complex process-hardware interactions. 
• Tool Troubleshooting: Help perform diagnostics on vacuum systems, RF power delivery, and gas flow controllers. Hands-on experience is highly valued. 

3. Sustaining & Standardization 

• Statistical Process Control (SPC): Implement and monitor SPC charts in JMP to identify trends, prevent excursions, and ensure long-term process stability. 
• Standardization: Author and maintain high-quality Standard Operating Procedures and technical documentation to ensure cross-shift consistency. 

Technical Expertise Preferred 

Deposition (Primary Focus) 

• PVD: Experience with RF, DC, and Pulsed DC Magnetron Sputtering, Ion Beam Deposition (IBD) and E-beam evaporation 
• CVD & ALD: Deep knowledge of PECVD, HDPCVD, ALD, and LPCVD. 
• Thermal: Proficiency in oxidation furnaces, annealing, and RTP/RTA. 

Dry Etch & Clean 

• Plasma Processing: Hands-on experience with Bosch process (DRIE), dielectric etching, plasma ashing, and Ion Beam Etching (IBE)  

Required Qualifications 

• B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics, or other engineering discipline. 
• 5+ years of experience in a semiconductor microfabrication manufacturing environment. 
• Deep understanding of material properties and the specific process knobs required to obtain them. 
• Expert-level proficiency in JMP for data analysis, statistical modeling, and DOE. 
• Proven track record of "hands-on" hardware troubleshooting. Ability to diagnose mechanical, electrical, and vacuum-related failures.