Senior Program Manager

• Your Career As a key member of the Technical Operations team, you will be responsible for driving development and supporting the launch of X86 hardware appliances, primarily with global contract manufacturing. You will work closely with cross-functional teams that include various development engineering teams (Electrical/Hardware, Mechanical, Compliance, Software, etc), operations teams (Test Engineering, Quality, Planning, Manufacturing Engineering, Component Engineering, Supply Base Management, Supply Chain Mgmt, etc.), and manufacturing partners.
• The ideal candidate will be able to drive programs at both a tactical & strategic level and have a blend of technical expertise & business acumen. Your efforts will result in cybersecurity products that provide industry-leading protection to our customers and outstanding business results for the company Your Impact Subject Matter Expert in new product introduction for x86 hardware appliances Collaborate on product development with cross-functional teams, including Electrical Engineering, Software Engineering, Product Management, Mechanical Engineering, Hardware Validation, Test Engineering, Quality, Compliance, Manufacturing, Supply Chain Mgmt, etc. Create schedules for hardware development and prototyping that align with software development schedule(s) to ensure a smooth transition into system integration Ensure that quality and reliability objectives are met through hardware validation, manufacturing test, and release management Develop phase gate release criteria and enforce completion of hardware validation with buy-in from cross-functional team Ensure Order Fulfillment readiness for all new SKUs and FRUs by collaborating with Business Systems, Planning, Supply Chain, Repair & Failure Analysis Engineering, Service Logistics, etc. Facilitate the Design for Manufacturing (DFM) process with global contract manufacturer and printed circuit board fabrication Ensure the Design for Assembly (DFA) process meets objectives for cost, quality and speed Identify and mitigate risks through early engagement, bug tracking and cross-functional risk assessment Support the Test Engineering team in meeting Design for Test (DFT) objectives Facilitate Product Characterization and Component Characterization to derisk DFM issues and assembly defects Make recommendations for risk buys based on product architecture and lead time analysis Identify cost-reduction opportunities through the development of should cost model and multi-sourcing Drive ECO (Engineering Change Order) and implement corrective actions Establish Traceability on components to trace the history, location and genealogy through multi-level BOM tracking Continuously improve the hardware product lifecycle through retrospectives and best practices Lead Post Ramp Qualification (PRQ) process for technical initiatives such as Hard Tooling and Optical Transceivers Provide technical guidance and mentorship to team members

• Your Experience 8+ Yrs Experience in product development and manufacturing environment. Proven experience managing cross-functional teams in NPI program management of x86 hardware platforms. Knowledge of Printed Circuit Board Assembly (PCBA) Strong knowledge of product development processes, including Hardware Validation, Product Characterization, Design for Test, Design for Manufacturing, and Design for Assembly Familiar with Product Development tools such as Valor, Arena, Jira and CAD Experience managing manufacturing processes and identifying cost-reduction opportunities Excellent communication and problem-solving skills Ability to work in a fast-paced environment and manage multiple projects simultaneously Strong project management skills, including risk assessment and schedule management. Experience with contract negotiations and commercial discussions Excellent supplier and material management experience Demonstrated entrepreneurial approach to Operations management in an ambiguous fast-paced environment handling multiple projects in parallel.

• Bachelor degree in an engineering discipline or equivalent experience.

• PRODUCT DEVELOPMENT
• NPI PROGRAM MANAGEMENT
• PRINTED CIRCUIT BOARD ASSEMBLY
• DESIGN FOR MANUFACTURING
• SCHEDULE MANAGEMENT

• HARDWARE VALIDATION
• PRODUCT CHARACTERIZATION
• DESIGN FOR TEST
• DESIGN FOR ASSEMBLY
• VALOR
• ARENA
• JIRA
• MANUFACTURING ENVIRONMENT
• CAD
• MANUFACTURING PROCESSES
• COST-REDUCTION
• COMMUNICATION
• PROBLEM SOLVING
• PROJECT MANAGEMENT
• RISK ASSESSMENT
• CONTRACT NEGOTIATIONS
• OPERATIONS MANAGEMENT
• SUPPLIER MANAGEMENT
• MATERIAL MANAGEMENT

• Pay any fee to be considered for, submitted to, or selected for any opportunity.
• Purchase any product, service, or gift cards from us or for us as part of an application, interview, or selection process.
• Provide sensitive financial information such as credit card numbers or banking information. Successfully placed or hired candidates would only be asked for banking details after accepting an offer from us during our official onboarding processes as part of payroll setup.

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