Overview
At Microsoft Quantum, we aim to empower science and scientists to solve the worlds biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology.
Microsoft Quantum team is dedicated to developing the first scalable, fault-tolerant quantum computer and is leading progress in areas ranging from quantum hardware and error correction to comprehensive integration with Azure. Our team comprises an accomplished and diverse international team focused on constructing a scalable quantum computing system. Our full-stack strategy encompasses breakthrough developments, spanning the physics of quantum devices to scalable readout and control infrastructures powered by cryo-electronics. The Microsoft Quantum program aims to transform the future of computing and tackle challenges that are currently beyond reach. We are entering a pivotal phase of accelerated growth in quantum computing, and this position presents a unique opportunity to contribute meaningfully to a transformative technology.
We are seeking a Senior Quantum Package & Motherboard Engineer role to adapt industry-standard packaging & motherboard design processes and materials to the unique requirements of cryogenic/quantum devices, working alongside a diverse team of engineers and scientists to assemble and scale complex quantum hardware. Success in this position requires close collaboration with our globally distributed team to establish common, robust assembly processes and materials.
Throughout the program lifecycle, you will engage with cross-functional teams-including architecture, quantum, verification, analog, physical design and vendors -to ensure that the design meets specifications and is successfully implemented and verified. This role requires relevant technical expertise, excellent communication skills, and the ability to manage complex design challenges in a collaborative environment.
This is a unique opportunity to be at the forefront of quantum hardware innovation. You will collaborate with leading physicists, quantum theorists, quantum experimentalists, research engineers, systems engineers, technical program managers, supply chain professionals, cloud architects, and external partners to accelerate the scale-up of topological qubits and quantum systems that unlock unprecedented scientific and business value. If you are energized by complex program management challenges, thrive in ambiguity, and have a passion for foundational technologies that redefine what's possible, we invite you to join us and help shape the future of quantum computing.
Microsoft's mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
Responsibilities
Develop and maintain robust Package & Motherboard design processes for quantum devices. Document processes and implement across our global team.
Design & drive external packaging material vendors to leverage existing supply chains to deliver solutions needed for packaging of quantum devices.
Design & drive PCB designs to deliver solutions needed for cryo/quantum solutions.
Simulate Packaging/Motherboard components for Signal & Power Integrity.
Own signaling chain - including specifications, material / connector / cable definition from Room-Temperature to Cryo/Quantum temperature logic.
Develop and improve electrical and PCB development processes, documentation, quality frameworks, design review practices, design for manufacturing, testability, and validation workflows, manufacturing readiness processes, dashboards, and reporting mechanisms.
Communicate clearly across technical and executive audiences, synthesize engineering and supplier input into decision frameworks, influence outcomes without direct authority, and mentor junior engineering planning coordinators and engineers while reinforcing Microsoft's values and inclusive culture.
Qualifications
Required/Minimum Qualifications
Doctorate in Physics, Engineering, or related field AND 1+ year(s) experience in industry or in a research and development environment, could include completion of a post doctoral research position
OR Masters Degree in Physics, Engineering, or related field AND 4+ years experience in industry or in a research and development environment
OR Bachelors Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment
OR equivalent experience.
Other Qualifications:
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:
Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Ability to leverage artificial intelligence (AI) tools to drive innovation and efficiency (e.g., measurement, performance modeling and analysis, research gathering, day-to-day task automation).
Ability to work in an "AI-first" environment using modern AI tools to accelerate discovery through hardware development.
Additional or Preferred Qualifications
Bachelors or Masters Degree in Electrical Engineering or related field.
10+ years design experience in Silicon Package Design and PCB Design.
Successfully delivered Silicon Packages and Motherboards into production.
Knowledge of industry standard tools/methodologies for Package and PCB Design.
Proficient in Analog Signal, Power Integrity & Signal Integrity simulations.
Self-starter with the ability to define and adhere to a schedule.
Good inter-personal skills, able to interface with a variety of external partners (customers, architects, designers, project managers, etc.) and are able to deliver complete layouts to customers.
Apply AI to accelerating Analog Layout execution times
Package, Motherboard, connector, cable designs at cryo temperatures
Experience working directly with PCBs and/or superconducting integrated circuit design teams, fabrication vendors, electronics manufacturing services and contract manufacturers (EMS/CMs), and external suppliers.
Apply AI to accelerating Analog Layout execution times
Package, Motherboard, connector, cable designs at cryo temperatures
Experience working directly with PCBs and/or superconducting integrated circuit design teams, fabrication vendors, electronics manufacturing services and contract manufacturers (EMS/CMs), and external suppliers.
Quantum Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800.00 - $234,700.00 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200.00 - $261,000.00 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.