Assemblers Technology, Leading Edge Technology, Project/Program Management, Research & Development (R&D), SIP (Session Initiation Protocol), Semiconductors
LOCATION
San Jose, CA
POSTED
1 day ago
Broadcom in San Jose is looking for an expert in advanced packaging technology to lead R&D efforts for semiconductor assembly. The successful candidate will oversee the development of cutting-edge assembly technologies for high-performance computing applications.With a focus on collaboration with design and validation teams, this role requires extensive experience and the ability to manage complex projects. The position offers a competitive salary and comprehensive benefits, including bonuses and stock options.#J-18808-Ljbffr