Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility
Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
Author and maintain requirements in MBSE; produce SSS and ICS with full traceability to sources and verification methods
Own EMI/EMC and environmental planning; define fixtures and pre‑qualification per applicable standards
Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
Mentor team members; uphold engineering rigor and documentation quality
Other duties as assigned
This position is contingent upon contract award.
Requirements
Education/Training:
Bachelor’s Degree in relevant engineering or science discipline required
Master’s degree preferred
Experience:
8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high‑power pulsed applications (L‑band preferred)
Hands‑on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout
Proficiency building high‑fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data
Requirements engineering using MBSE tools (e.g., Cameo)
Authoring System/Subsystem Specifications and Interface Control Specifications
EMI/EMC planning and pre‑qualification per MIL‑STD‑461; environmental and ESS testing per MIL‑STD‑810
Security:
Must be a US citizen
If selected candidate does not have an active Clearance at level Secret or higher, one will be obtained upon hire
Physical Requirements:
Able to occasionally reach with hands and arms
Prolonged periods of computer screen use, while sitting or standing at a desk
Adhere to safety protocols when in work areas requiring use of PPE (e.g. eyewear, gloves, masks, hearing protection, steel toed shoes, etc.)
Able to safely lift and carry up to 20 pounds at a time
Benefits
Health Care Plan (Medical, Dental & Vision)
Retirement Plan (401k, IRA)
Life Insurance (Basic, Voluntary & AD&D)
Paid Time Off (Vacation, Sick & Public Holidays)
Short Term & Long Term Disability
Training & Development
Wellness Resources
Salary: $135,000 - $150,000
Salary rates for this position are competitive and commensurate with experience and industry standards. We offer a comprehensive benefits package that may include health insurance, paid time off, and retirement savings options.
Numbers & Facts
Location
Oklahoma City, OK
Skills
Circuit Designunmatched
Documentationunmatched
Electromagnetic Compatibilityunmatched
Electromagnetic Interference (EMI)unmatched
Governmentunmatched
HFSS (High Frequency Structure Simulator)unmatched
Health Planunmatched
High Power Amplifier (HPA)unmatched
IP Multimedia System (IMS)unmatched
Lift/Move 20 Poundsunmatched
Market Surveysunmatched
Mentoringunmatched
New Drug Applicationunmatched
Physical Demandsunmatched
Power Amplifierunmatched
Project Management Professional (PMP)unmatched
Prototypingunmatched
RAID Storageunmatched
Radio Engineeringunmatched
Radio Frequencyunmatched
Risk Managementunmatched
Simulationunmatched
Status Reportsunmatched
System Readiness Review (SRR)unmatched
Test Designunmatched
Topologyunmatched
Traceabilityunmatched
United States Citizenunmatched
Writing Skillsunmatched
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