Join Intel's Innovation Journey
Are you passionate about driving breakthrough technologies that power the world's most advanced computing solutions? Intel Foundry Group is seeking a talented Senior Yield Engineer – Substrate & Advanced Packagingto join our Advanced Packaging Technology and Manufacturing team. In this role, you'll be at the forefront of semiconductor innovation, working with cutting-edge technology nodes and making direct impact on next-generation products that shape the future of computing.
What You'll Do
Drive Technology Excellence Through Data-Driven Insights
Transform Complex Data into Actionable Solutions
Collaborate Across Teams for Maximum Impact
Innovate with Advanced Tools and Methodologies
Behavioral traits that we are looking for:
Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
See Intel Benefits for more details.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Note:
For information on Intel’s immigration sponsorship guidelines, please see
Intel U.S. Immigration Sponsorship Information
Minimum Qualifications and Experience:
Candidate must possess a Masters degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry/Physics or related field and 5+ years of experience. Or a PhD degree in the same fields and 3+ years of experience.
Preferred Qualifications and Experience:
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