Alternative Energy, Automation, Cloud Computing, Communication Skills, Component Assembly, Cross-Functional, Emerging Technology, Intellectual Property (IP), Leadership, Manufacturing, Molding Processes, Package Layout Design, Plating Processes, Problem Solving Skills, Process Flow, Progress Reports, Sales, Team Lead/Manager, Technical Leadership, Technical Support, Wire Bonding
Technical and customer support for the qualification of SiC die sales and development
SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
- Strong communication skills
- Ability to lead development projects and implement strategies on a global basis
- Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding
- Knowledge of materials and material interactions
- Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals
- Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams
- Understand detailed customer requirements and verify latest technologies meet or exceed all expectations
- Document findings and process flows to create baseline for new technology platforms
- Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis.
- Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals
- Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams
- Understand detailed customer requirements and verify latest technologies meet or exceed all expectations
- Document findings and process flows to create baseline for new technology platforms
- Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis.