Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

We are seeking a Signal or Power Integrity Engineer to join our hardware team and contribute to SI/PI analysis and optimization of advanced packaging solutions for next-generation machine learning and data center ASICs.

In this role, you will support the package-level signal or power integrity effort - performing detailed simulations, building models, and contributing to design decisions across IC, package, and board boundaries. Youll work closely with senior engineers to help ensure our advanced packaging technologies meet performance, power delivery, and manufacturing targets.

Key job responsibilities

• Perform package-level SI or PI simulations for 2.5D, 3D-IC, fan-out, and silicon interposer/bridge architectures under guidance from senior engineers.
• Support package stack-up design: assist with dielectric material evaluation, impedance control analysis, layer assignment, and RDL routing studies.
• Run high-speed channel simulations (S-parameter extraction, time-domain analysis, eye diagrams) for die-to-die and die-to-board interfaces, or analyze package PDN performance (decoupling effectiveness, plane resonance, IR drop, AC impedance).
• Model advanced interconnects: microbumps, C4 bumps, TSVs, microvias, PTH vias, and RDL traces for signal or power paths.
• Build and validate models for decoupling technologies such as on-die capacitance, deep trench capacitors (DTCs), or IPD capacitors as needed.
• Coordinate with SoC die-level teams and board design teams to gather requirements and support co-optimization of package architecture.
• Flag potential package manufacturing risks - warpage, via reliability, impedance variation - and propose mitigation approaches.

A day in the life Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures, and were building an environment that celebrates knowledge-sharing and mentorship. Our senior members enjoy one-on-one mentoring and thorough, but kind, code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future.

Diverse Experiences AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasnt followed a traditional path, or includes alternative experiences, dont let it stop you from applying.

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