Foxconn Technology Group, a globally leading electronics manufacturing company, is now hiring a SMT Process Experiment Engineer. Lead failure mode experiment analysis of SMT (surface mounting technology, Consumer Electronics Industry), such as Cross-section/Dye & pry / Thrust & Pull/ Torsion etc. Experimental anomaly analysis SMT process defects, such as void, crack, cold solder using optical microscopy, data support for process optimization and collaborate with DFM teams to improve designs based on failure mode data. Develop test methodologies for new materials (low temperature solders, Flex PCBs)
1. Lead SMT failure mode experiment analysis: such as Cross-section, Dye &pry, Thrust-pull\Torsion etc.2. Preparation SMT failure mode experiment analysis report3. Maintenance experimental equipment 4. Manage and training operation technicians5. Optimize failure mode experiment analysis processes and methods to improve efficiency and accuracy6. Support Line-qualification of SMT lines and progress tracking
Educational Requirements: Bachelor's degree or aboveThe best major in electronics,mechanical enigerring, chemistry and physics.Work Experience (Nice-to-Have): Preference is given to those with relevant work experience, and outstanding recent graduates are also eligible to apply.