$131,706–$135,000 Per Year
ASIC (Application Specific Integrated Circuit), Analysis Skills, CMOS, Corrective Action, Data Analysis, Datasheets, Debugging Skills, Forecasting, IP (Internet Protocol), Information Technology & Information Systems, Manufacturing Engineering, Mass Production, Material Science, Materials Engineering, Performance Tuning/Optimization, Physics, Problem Solving Skills, Process Analysis, Process Flow, Process Improvement, Product Engineering, Product Flow, Productivity Management, Python Programming/Scripting Language, Research & Development (R&D), Semiconductors, Supplier Optimization, Team Player, Test Plan/Schedule, Test Program, Testing
Design a characterization/testing plan and work with R&D teams and manufacturing engineers to resolve various technical issues to meet performance requirements; participate in product definition and provide DFM inputs; work in close collaboration with silicon foundry, imager characterization and pixel design; interact with foundry fab in improving all silicon process, color, and package issues; improve product yield and performance by process optimization and layout design update; analyze yield and drive corrective actions for yield improvements; drive characterization to finalize the product datasheet; work with pixel design group to design the most sophisticated and optimized pixel layout; work with characterization team to analyze and debug pixel device circuit and various image related issues; ramp up for image sensors and ASIC devices; coordinate with company's fab to drive semiconductor processing tool vendors to optimize processes, including raw material vendor, IMP tool vendor and photo resist vendor etc.; set up new tape out product process flows, inline handbooks, JDV check etc.; work with testing engineers to develop, verify and release testing program at CP or FT.Program coding, such as python, to improve work efficiency in data analysis.
Requirements:
Master’s degree or foreign equivalent degree in Materials Science & Engineering, Physics, or related fields.
Require two years of experience in process integration.
Require experience/skills of:
- Analyze the correlation among Yield/Defect/Inline/Reliability and reduce lost.
- Assess CMOS Imaging Process to maximize the production capacity in Fab.
- Construct multiple work systems with IT to reduce workload.
- Release CMOS Imaging Process proposals to deduct the expense of material and improve the yield of wafer edge.
- Conduct a course to enhance colleagues' vigilance against product defect disasters.
- Implement customers’ IP design into new node and perform trial run in Fab.
- Forecast yield precisely and estimate the target in next season.
- Plan the process/testing priority of the product to trace issues during the mass production.
- Ensure the quality of the wafers by the strict management from wafer-start to fab-out.
Annual base salary for this role in California, US is expected to be between $131,706 - $135,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.
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Omnivision Technologies
OmniVision Technologies is a leading developer of advanced digital imaging solutions. Its award-winning CMOS imaging technology enables superior image quality in many of today’s consumer and commercial applications, including mobile phones, notebooks, tablets and webcams, digital still and video cameras, security and surveillance, entertainment devices, automotive and medical imaging systems. Find out more at www.ovt.com.
1,500 to 1,999 employees
Electronics, Components, and Semiconductor Mfg