Amazon LEO is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.
To deliver on that mission, Amazon is looking for talented candidates who are intellectually curious, have solved complex problems, and have a demonstrated ability to get the right things done quickly and effectively.
A day in the life:
As a Sr. Hardware Design Engineer, you will have the opportunity to work on some of the most innovative, challenging, and exciting LEO satellite systems in industry right now. You will engage with an experienced team to conceive and design the 2nd generation satellite gateway payload electronics aimed at delighting customers with affordable, reliable, high bandwidth connectivity. That will involve working closely with Amazon LEOs various sub-teams and engage third party suppliers to drive product definition, design, optimization, implementation, and test.
The Hardware Design Engineer will have a complete understanding of how their design changes impact downstream partners such as operations, supply chain, product management, and reliability. Amazon strongly believes in Ownership and you will have the opportunity to own your designs from concept through production.
You will own or contribute to the following:
Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
About the team
The satellite gateway team is responsible for the architecture, design, implementation, validation, qualification, and new product introduction to manufacturing for all satellite and ground gateway electronics. These systems will meet performance requirements defined by the RF/modem team as well as environmental and reliability requirement by space environment. To this end, the gateway RF Hardware team collaborates closely with all the partner teams including silicon, power, mechanical, thermal, modem, RF/Coms system, and SW teams.