As a Staff PIC Process Development Engineer, you will be a senior individual contributor within Nokia's Optical Components organization, responsible for the development, optimization, and transfer of InP photonic integrated circuit (PIC) and laser fabrication processes for high‑volume manufacturing.
This role requires deep technical expertise across epitaxial design, semiconductor processing, data‑driven manufacturing analysis, and close collaboration with remote fabrication partners. You will play a key role in enabling next‑generation optical component technologies that support Nokia's high‑capacity optical networking platforms.
Ph.D. in Electrical Engineering, Physics, or a related field
Minimum 3 years of industry experience developing and manufacturing InP PIC or laser fabrication processes for high‑volume applications
Demonstrated expertise in:
Design of epitaxial layer structures
Process design and fabrication process development for InP devices or PICs
Photonic device data query and analysis in a manufacturing environment
Metal, semiconductor, and dielectric deposition and etching tools, chemistries, and methods
FMEA, SPC, process capability, and metrology
Building end‑to‑end fabrication process flows from tool and design specifications
Proven ability to work effectively with remote fabs and cross‑site teams
Preferred Qualifications
- Experience supporting technology transfer to high‑volume manufacturing
- Familiarity with yield ramp, qualification, and reliability testing for photonic devices
- Strong communication skills with the ability to translate complex technical issues across disciplines
- Experience working in foundry or captive fab environments supporting compound semiconductor technologies
Process Development & Integration
- Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‑volume manufacturing
- Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers
- Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints
- Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules
Manufacturing Data & Yield Excellence
- Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment
- Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance
- Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues
- Define and utilize metrology strategies to ensure robust process control
Fab Execution & Cross‑Functional Collaboration
- Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers
- Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities
- Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp
Technical Leadership & Impact
- Provide technical leadership within the PIC process development domain
- Contribute to continuous improvement of tools, methods, and best practices
- Mentor junior engineers and support knowledge transfer across the broader team
Process Development & Integration
- Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‑volume manufacturing
- Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers
- Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints
- Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules
Manufacturing Data & Yield Excellence
- Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment
- Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance
- Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues
- Define and utilize metrology strategies to ensure robust process control
Fab Execution & Cross‑Functional Collaboration
- Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers
- Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities
- Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp
Technical Leadership & Impact
- Provide technical leadership within the PIC process development domain
- Contribute to continuous improvement of tools, methods, and best practices
- Mentor junior engineers and support knowledge transfer across the broader team