Staff Process Engineer, APTD Bonding

Micron Technology

Boise, ID

JOB DETAILS
SKILLS
8D, Analysis Skills, Assembly Line, Budgeting, Chemical Engineering, Chemistry, Cost Control, DRAM, Develop Methodologies, Electrical Engineering, Equipment Specification, Experiment Design, Failure Analysis, Failure Mode and Effects Analysis (FMEA), Healthcare, Identify Issues, Leadership, Material Science, Materials Analysis, Materials Testing, Mechanical Engineering, Memory Hardware, Physics, Problem Solving Skills, Process Development, Process Engineering, Process Improvement, Productivity Management, Quality Management, Requirements Management, Risk Management, Semiconductors, Startup, Statistical Process Control, Team Lead/Manager, United States Department of Energy (DOE)
LOCATION
Boise, ID
POSTED
2 days ago

Req ID: JR100411 Staff Process Engineer, APTD BondingPosition Overview As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.Responsibilities Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methodsIdentify, diagnose, and resolve assembly process-related problemsCoordinate and complete process, equipment, and material evaluation/optimization initiatives and implement changes at process stepValidate and fan out new process baseline qualified, including new process, tools, and/or materials for new product introductionSupport SPC/FDC/RMS/APC, and site-to-site portabilityAudit material suppliers to achieve quality, cost and risk management objectivesMinimum Qualifications BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics + 5 years of relevant industry experienceKnowledge of Advanced Package Integration and DRAM, NAND, or other memory productsExperience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis and data analysisExperience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactionsAbility to resolve sophisticated issues through root-cause or model-based problem solving and adjust to shifting responsibilities and needs of the teamPreferred Qualifications MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical EngineeringExperience leading project teams and providing leadership updatesJob Profile(s) Semiconductor Process Engineer 4Relocation Level TBDBenefits As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.Equal Opportunity Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.#J-18808-Ljbffr

About the Company

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Micron Technology